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KLMDG4UCTB-B041 KLMDG8JEUD-B04P KLMDG8JEUD-B040 P2P PS8229 eMMC and RS70BT7G4S09F

PHISON PS8229 eMMC main control chip with a capacity of 128GB, embedded multimedia card package 153Balls and Artmem RS70BT7G4S09F P2P replace SAMSUNG KLMDG4UCTB-B041 KLMDG8JEUD-B04P KLMDG8JEUD-B040. If you need datasheet for these three brand models, please feel free to contact us if you want to know which model is cheaper.

PHISON

Control ic

eMMC versionCapacityNAND FLASH typeContinuous read/write (up to)Packaging typePackage SizeOperating temperatureSpecification Grade
PS82295.14GB ~ 64GB3D TLC280/180 MB/s153 Balls11.5 x 13 x 1.0-40℃~ 105℃Automotive AEC. Grade2
PS82295.14GB ~ 128GB3D TLC280/180 MB/s153 Balls11.5 x 13 x 1.0-40℃~ 85℃Automotive AEC. Grade3
PS82295.14GB ~ 128GB3D TLC280/180 MB/s153 Balls11.5 x 13 x 1.0-40℃~ 85℃Industrial

SAMSUNG

Control iceMMC versionCapacityWorking voltageInterfacePackaging typePackage SizeOperating temperatureMin Qty
KLMDG4UCTB-B041
KLMDG8JEUD-B04P
KLMDG8JEUD-B040
eMMC 5.164G/16G/8G1.8 / 3.3 VHS400153 Balls11.5 x 13 x 0.8 mm-25 ~ 85 °C1120

Artmem

Control iceMMC versionCapacityNAND Flash TypeUser Density (MB)Packaging typePackage SizeStorage without OperationMin Qty
RS70BT7G4S09FeMMC128GB512Gb * 2119,280153 TFBGA11.5x13x0.92-40oC ~ 85oC1520

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Winbond stock memory chips

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