PHISON PS8229 eMMC main control chip with a capacity of 128GB, embedded multimedia card package 153Balls and Artmem RS70BT7G4S09F P2P replace SAMSUNG KLMDG4UCTB-B041 KLMDG8JEUD-B04P KLMDG8JEUD-B040. If you need datasheet for these three brand models, please feel free to contact us if you want to know which model is cheaper.
PHISON
|
Control ic |
eMMC version | Capacity | NAND FLASH type | Continuous read/write (up to) | Packaging type | Package Size | Operating temperature | Specification Grade |
| PS8229 | 5.1 | 4GB ~ 64GB | 3D TLC | 280/180 MB/s | 153 Balls | 11.5 x 13 x 1.0 | -40℃~ 105℃ | Automotive AEC. Grade2 |
| PS8229 | 5.1 | 4GB ~ 128GB | 3D TLC | 280/180 MB/s | 153 Balls | 11.5 x 13 x 1.0 | -40℃~ 85℃ | Automotive AEC. Grade3 |
| PS8229 | 5.1 | 4GB ~ 128GB | 3D TLC | 280/180 MB/s | 153 Balls | 11.5 x 13 x 1.0 | -40℃~ 85℃ | Industrial |
SAMSUNG
| Control ic | eMMC version | Capacity | Working voltage | Interface | Packaging type | Package Size | Operating temperature | Min Qty |
| KLMDG4UCTB-B041 KLMDG8JEUD-B04P KLMDG8JEUD-B040 |
eMMC 5.1 | 64G/16G/8G | 1.8 / 3.3 V | HS400 | 153 Balls | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | 1120 |
Artmem
| Control ic | eMMC version | Capacity | NAND Flash Type | User Density (MB) | Packaging type | Package Size | Storage without Operation | Min Qty |
| RS70BT7G4S09F | eMMC | 128GB | 512Gb * 2 | 119,280 | 153 TFBGA | 11.5x13x0.92 | -40oC ~ 85oC | 1520 |
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