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Winbond NOR Flash

Winbond’s W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512Kbit to 2G-bit, small erasable sectors and the industry’s highest performance. The W25Q family with Dual-I/O and QuadI/O SPI offers even higher performance. Clock rates up to 133MHz achieve an equivalent of 532MHz (66M-Byte/s transferrate) when using Quad-SPI. Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interfaceor further improve boot time when shadowing code to RAM. Some SpiFlash® devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form-factor packages are ideal for space constrained mobile and handheld applications.

W25X SpiFlash® Family
– 512K-bit to 4M-bit
– Serial Peripheral Interface (SPI), Dual Output SPI
– Uniform 4KB, 32KB & 64KB erase

W25Q SpiFlash® Family
– 2M-bit to 2G-bit, superset compatible with 25X
– SPI, Dual-SPI, Quad-SPI and QPI (for many devices)
– Uniform 4KB, 32KB & 64KB erase
– Erase and Program Suspend/Resume
– Quad Page Program
– Security: Lock-down, ID#, OTP Registers
– Serial Flash Discoverable Parameters (SFDP)

High Performance
– 133MHz Clock Rate, Quad-SPI (66MB/s)
– Fast-boot or execute code (XIP) from SPI
Voltage & Package Options
– 3V (2.7~3.6V), 2.5V (2.3~3.6V) and 1.8V (1.65~1.95V)
-Space saving packages: 8-pin SOIC, WSON,
VSOP, USON, WLCSP, 16-pin SOIC, 24-ball
TFBGA
– Known Good Die (KGD) Wafers

Wide Range of Applications
– PCs, DVD, BluRay, WLAN, DSL/Cable Modem, Printers,
– Hard Drives, Set Top Box, LCD-TV, Mobile Phones,
– Bluetooth, GPS, MP3, Meters, DSP, FPGAs and more

Density Winbond Part #2 Clock
MHz
Features 3 Voltage Package Temp.
2G-bit W25Q02JVxxIM 104 QPI,Enhanced,DTR 3V Xx=(TB°) -40℃ ~ 85℃ / -40℃ ~ 105℃
1G-bit W25Q01JVxxIM/Q 104 QPI,Enhanced,DTR 3V xx=(SF,ZE,TB⁶) -40℃ ~ 85℃ / -40℃ ~ 105℃
512M-bit W25Q512JVxIM/Q 133 QPI,Enhanced,DTR 3V x=(F,E,B) -40℃ ~ 85℃ / -40℃ ~ 105℃
256M-bit W25Q256JVxIM/Q 133 QPI,Enhanced,DTR 3V x=(F,E,C,B⁶) -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
W25Q256JWxIM/Q 133 QPI,Enhanced,DTR 1.8V x=(F,E,C,B⁶ -40℃ ~ 85℃
128M-bit W25Q128JVxIM/Q 133 QPI,Enhanced,DTR 3V x=(S.TS F,P,E.C6B6 -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
W250128JWxIMIO 133 QPI,Enhanced,DTR 1.8V x=(S,F6,P -40℃ ~ 85℃
64M-bit W25Q64JVxxIMVQ 133 QPI,Enhanced,DTR 3V xx=(SS,ST⁸,SF,ZP,ZE,XG,TC,TB°) -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
W25Q64JWxxIM/Q 133 QPI,Enhanced,DTR 1.8V xx=(SS,ST,SF⁸,ZP,BY) -40℃ ~ 85℃
32M-bit W25Q32JVxxIM/Q 133 QPI,Enhanced,DTR 3V xx=(SS,ST⁶,SF,ZP,XG°,TC°,TB⁸ -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
W25Q32JWxxIM/Q 133 QPI,Enhanced,DTR 1.8V xx=(SS,ST⁸,SF°,ZP,ZE⁶,XG,BY°) -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
16M-bit W25016JVxxIM/Q 133 QPI,Enhanced,DTR 3V xx=(SN,SV,SS,ST,ZP,UU,XG,UX,BY) -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
W25Q16JWxxIM/Q 133 QPI,Enhanced,DTR 1.8V xx=(SS,ST⁶,ZP,UX,UU,XG⁶,BY6) -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
8M-bit W25Q80DVxxIG/E⁷ 104 Fast Write,Enhanced 3V xx=(SN,SV,SS,ZP,UX,BY) -40℃ ~ 85℃
4M-bi   W25X40CLxxIG 80/104 Fast Write 2.3V-3.6V xx=(SN,SV,SS,ZP,UX) -40℃ ~ 85℃
2M-bit   W25X20CLxxIG 80/104 Fast Write 2.3V-3.6V xx=(SN,SV.ZP.UX -40℃ ~ 85℃
1M-bit   W25X10CLxxIG 80/104 Fast Write 2.3V-3.6V xx=(SN,UX) -40℃ ~ 85℃

Winbond’s W25X and W25Q SpiFlash ® Multi I/O memory supports a universal SPI interface, with capacities ranging from 512Kb to 512Mb, and features small capacity split erasable blocks and industry performance. The W25X series supports Dual SPI dual line output input mode, which is equivalent to doubling the operating frequency of the original standard SPI.

The W25Q series is an advanced version of the 25X series, which supports Quad I/O SPI four wire output input mode to provide higher performance. The operating frequency of 104MHz is equivalent to 416MHz (50M Byte/S transmission rate), which is equivalent to four times the performance of typical single wire SPI operations. The W25Q series not only outperforms Parallel flash in performance, but also offers packaging with fewer pins.

A faster transmission rate means that the controller can directly execute on-chip (XIP, eXecute In Place) with flash memory through the SPI interface, or accelerate the copying of code to RAM for faster startup speed. In addition, some SpiFlash supports QPI (Quad Peripheral Interface) to enable faster instruction set transfer and accelerate the transfer efficiency of XIP. In addition, smaller packaging is more conducive to the application of handheld and mobile devices with limited design space.

 

Industrial

Industrial Plus

Automotive Grade 3

Automotive Grade 2

Automotive Grade 1

 

 

Temperature Range

-40°C~85°C

-40°C~105°C

-40°C~85°C

-40°C~105°C

-40°C~125°C

Part # Example

W25Q64JVSSIQ

W25Q64JVSSJQ

W25Q64JVSSBQ

W25Q64JVSSAQ

W25Q64JVSSSQ

AEC-Q100 Compliant

No

No

Yes

Yes

Yes

Change Control (PPAP)

No

No

Optional

Optional

Optional

In terms of shipment quantity and revenue of Serial Flash, Winbond is in an advanced position. Memory products with TS16949 and AEC-Q100 certifications can be applied to automobiles. Nowadays, cars have begun to adopt more precision electronic devices, such as digital display dashboards, which display 2D/3D graphics in real-time through fast processors and SpiFlash memory, providing more driving information to improve safety. Advanced Driver Assistance Systems (ADAS), Entertainment and Navigation systems can now coexist in the driver’s center console. By using a smaller SpiFlash memory package, limited space designs can use higher memory capacity in more advanced applications.

Winbond flash stock, answer alternative models, help find cost-effective P2P alternatives, welcome to consult.

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