Winbond 1.2V Serial NOR flash memory
Winbond 1.2V Serial NOR flash, the first flash memory to support ultra-low voltage operation.
The W631GG6MB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words 8 banks 16 bits. This device achieves high speed transfer rates up to 2133 MT/s (DDR3-2133) for various applications.
Brand:
WinbondGENERAL DESCRIPTION
The W631GG6MB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words 8 banks 16 bits.
This device achieves high speed transfer rates up to 2133 MT/s (DDR3-2133) for various applications.This device is sorted into the following speed grades: -09, -11, -12, -15, 09I, 11I, 12I, 15I, 09J, 11J,12J and 15J.
The -09 ,09I and 09J speed grades are compliant to the DDR3-2133 (14-14-14) specification (The 09I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 09J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C).
The -11 ,11I and 11J speed grades are compliant to the DDR3-1866 (13-13-13) specification (The 11I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 11J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C).
The -12, 12I and 12J speed grades are compliant to the DDR3-1600 (11-11-11) specification (The 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 12J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C).
The -15, 15I and 15J speed grades are compliant to the DDR3-1333 (9-9-9) specification (The 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 15J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C).
The W631GG6MB is designed to comply with the following key DDR3 SDRAM features such as
posted CAS#, programmable CAS# Write Latency (CWL), ZQ calibration, on die termination and
asynchronous reset. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a differential DQS-DQS# pair in a source synchronous fashion.
FEATURES
Power Supply: VDD, VDDQ = 1.5V ± 0.075V
Double Data Rate architecture: two data transfers per clock cycle
Eight internal banks for concurrent operation
8 bit prefetch architecture
CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14
Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly
(OTF)
Programmable read burst ordering: interleaved or nibble sequential
Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
Edge-aligned with read data and center-aligned with write data
DLL aligns DQ and DQS transitions with clock
Differential clock inputs (CK and CK#)
Commands entered on each positive CK edge, data and data mask are referenced to both edges of
a differential data strobe pair (double data rate)
Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command,
address and data bus efficiency
Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
Auto-precharge operation for read and write bursts
Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
Precharged Power Down and Active Power Down
Data masks (DM) for write data
Programmable CAS Write Latency (CWL) per operating frequency
Write Latency WL = AL + CWL
Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence
System level timing calibration support via write leveling and MPR read pattern
ZQ Calibration for output driver and ODT using external reference resistor to ground
Asynchronous RESET# pin for Power-up initialization sequence and reset function
Programmable on-die termination (ODT) for data, data mask and differential strobe pairs
Dynamic ODT mode for improved signal integrity and preselectable termination impedances during
writes
2K Byte page size
Interface: SSTL_15
Packaged in VFBGA 96 Ball (7.5x13 mm2 with thickness of 1.0 mm) - (Window BGA Type), using
lead free materials with RoHS compliant
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