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Winbond W25X/W25Q Spi Flash Serial NOR Flash Memory

Serial NOR Flash

Spi Flash®Memories with SPI, Dual-SPI, Quad-SPI and QPI

Part NO. W25Q64JVSSIQ,W25Q64JVSSJQ,W25Q64JVSSBQ,W25Q64JVSSAQ,W25Q64JVSSSQ

  • Brand:

    Winbond
  • Product Details

Products Descriptions:

Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance.


The W25X family supports Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. This is more than four times the performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space.


Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM. Additionally, some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form factor packages are ideal for space constrained mobile and handheld applications.


Products Applications:

Leading the Serial Flash Market in unit sales and revenue, Winbond TS16949 certified AEC-Q100 qualified memories now support automotive applications. The automobile has transformed into the most sophisticated electronic device in the market. Digital displays in automotive dashboards provide more information about the car, and improve safety. Instant-on and real time 2D/3D image rendering is achieved with fast processors and SpiFlash memories. ADAS (Advanced Driver Assist Systems), comfort, entertainment, and navigation is now available in the center console and this is addressed with SpiFlash memories using small packages for space constrained systems and high density for advanced applications.


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