Winbond W25Q64JWSSIQ 64M FLASH

GENERAL DESCRIPTIONS

The W25Q64JW (64M-bit) Serial Flash memory provides a storage solution for systems with limited space,pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.

They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on 1.7V to 1.95Vpower supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages.

The W25Q64JW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64JW has 2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. 

The W25Q64JW supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 532MHz (133MHz x 4) for Quad I/O when using the SPI Fast Read Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. 

Additionally, the device supports JEDEC standard manufacturer and device ID, and a 64-bit Unique Serial Number and three 256-bytes Security Registers.

FEATURES

 New Family of SpiFlash Memories

– W25Q64JW: 64M-bit / 8M-byte

– Standard SPI: CLK, /CS, DI, DO

– Dual SPI: CLK, /CS, IO0, IO1

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

– Software & Hardware Reset(1)

 Highest Performance Serial Flash

– 133MHz Quad I/O SPI clocks

– 66MB/S continuous data transfer rate

– Min. 100K Program-Erase cycles

– More than 20-year data retention

 Low Power, Wide Temperature Range

– Single 1.7V to 1.95Vsupply

– <1µA Power-down (typ.)

– -40°C to +85°C/+105°C operating range

 Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4K/32K/64K-Byte)

– Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

 Advanced Security Features

– Software and Hardware Write-Protect

– Special OTP protection

– Top/Bottom, Complement array protection

– Individual Block/Sector array protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers

– Volatile & Non-volatile Status Register Bits

 Space Efficient Packaging

– 8-pin SOIC 208-mil

– 8-pad XSON 4x4-mm

– 8-pad USON 4x3-mm

– 8-pad WSON 6x5-mm / 8x6-mm

– 24-ball TFBGA 8x6-mm (5x5 ball array)

– 12-ball WLCSP

– Contact Winbond for KGD and other options