Winbond W25Q32JVSSIQ 3V 32M-BIT Serial Flash Memory With

GENERAL DESCRIPTIONS
The W25Q32JV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space,
pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing
voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low
as 1µA for power-down.

The W25Q32JV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes
can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32JV has
1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater
flexibility in applications that require data and parameter storage. (See Figure 2.) 

The W25Q32JV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad
output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and
I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz
(133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad
I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash
memories. 

Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-

bit Unique Serial Number and three 256-bytes Security Registers.

FEATURES
 New Family of SpiFlash Memories
– W25Q32JV: 32M-bit / 4M-byte
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1,
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset(1)
 Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
– 266/532MHz equivalent Dual/Quad SPI
– 66MB/S continuous data transfer rate
– Min. 100K Program-Erase cycles per sector
– More than 20-year data retention
 Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
 Low Power, Wide Temperature Range
– Single 2.7V to 3.6V supply
– <1µA Power-down (typ.)
– -40°C to +85°C operating range
– -40°C to +105°C operating range
 Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
 Advanced Security Features
– Software and Hardware Write-Protect
– Special OTP protection(2)
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers
– Volatile & Non-volatile Status Register Bits
 Space Efficient Packaging
 – 8-pin SOIC/VSOP 150/208-mil
– 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 8-pad USON 4x3-mm
– 8-pad XSON 4x4-mm
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– Contact Winbond for KGD and other options