Winbond 1.2V Serial NOR flash memory
Winbond 1.2V Serial NOR flash, the first flash memory to support ultra-low voltage operation.
For Industrial & Industrial Plus Grade.
The W25Q32JV supports Standard SPI, Dual SPI and Quad SPI operation in each individual stacked die.All 8-bit instructions are shifted into the device through DI (IO0) pin, address and data are shifted in and out of the device through either DI & DO pins for Standard SPI instructions, IO0 & IO1 pins for Dual SPI instructions, or IO0-IO3 pins for Quad SPI instructions.
Brand:
Winbondbit Unique Serial Number and three 256-bytes Security Registers.
FEATURES
New Family of SpiFlash Memories
– W25Q32JV: 32M-bit / 4M-byte
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1,
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset(1)
Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
– 266/532MHz equivalent Dual/Quad SPI
– 66MB/S continuous data transfer rate
– Min. 100K Program-Erase cycles per sector
– More than 20-year data retention
Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 2.7V to 3.6V supply
– <1µA Power-down (typ.)
– -40°C to +85°C operating range
– -40°C to +105°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Special OTP protection(2)
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC/VSOP 150/208-mil
– 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 8-pad USON 4x3-mm
– 8-pad XSON 4x4-mm
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– Contact Winbond for KGD and other options
Indasina, a group corporation composed of factories, is committed to a variety of electronic products and the overall customized solutions.