Winbond W25Q01JVSFIQ 3V 1G-BIT SERIAL FLASH MEMORY WITH

GENERAL DESCRIPTIONS

The W25Q01JV (two x 512M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP)and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages.

The W25Q01JV device is a two 512M-bit stack die that supports linear addressing for the full 1G-bit memory address range.

The W25Q01JV array is organized into 524,288 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q01JV has 32,768 erasable 4KB sectors and 2,048 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage.

The W25Q01JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3. SPI clock frequencies of W25Q01JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.

Each 512M-bit die has its own 64-bit Unique Serial Number. Each die also has their individual (independent) ‘Status only’ Status Register bits including BUSY bit, SUS bit, that provides the current state of the die.

Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-bit Unique Serial Number and three 256-bytes Security Registers.

FEATURES

 New Family of SpiFlash Memories

– W25Q01JV: two 512M-bit / 128M-byte

– Standard SPI: CLK, /CS, DI, DO

– Dual SPI: CLK, /CS, IO0, IO1, 

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – 3 or 4-Byte Addressing Mode

– Software & Hardware Reset(1)

 Highest Performance Serial Flash 

– 133MHz Standard/Dual/Quad SPI clocks

– 266/532MHz equivalent Dual/Quad SPI

– 66MB/S continuous data transfer rate

– Min. 100K Program-Erase cycles 

– More than 20-year data retention

 Efficient “Continuous Read”

– Quad Peripheral Interface 

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

 Low Power, Wide Temperature Range

– Single 2.7 to 3.6V supply

–<2µA Power-down (typ.)

– -40°C to +85°C operating range

– -40°C to +105°C operating range

 Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

 Advanced Security Features

– Software and Hardware Write-Protect

– Power Supply Lock-Down 

– Special OTP protection

– Top/Bottom, Complement array protection

– Individual Block/Sector array protection

–Two 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits

 Space Efficient Packaging(2) – 8-pad WSON 8x6-mm

– 16-pin SOIC 300-mil (additional /Reset pin)

– 24-ball TFBGA 8x6-mm(5x5 ball array)

– Contact Winbond for KGD and other options