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/Winbond SpiStack Flash memory combine homogeneous and heterogeneous memory in one package

Winbond SpiStack Flash memory combine homogeneous and heterogeneous memory in one package

*W25M SpiStack product series

*Stack memory for various capacity combinations of Flash products

*Users can easily choose the size of the required capacity

*Standard SPI interface

*Compatible with existing SpiFlash

  • Product Details

Products Descriptions:

Winbond is the first memory vendor to combine homogeneous and heterogeneous memory in one package. The product line -W25M- provides not only a more flexible combination of memory capacity, but also a more convenient way for users from a system design perspective.


The W25M series can combine two or more chips and maintain the original simple 8-pin package. This allows customers to drive memory products of various sizes with the original control code and through the original generic SPI interface.


The push stack of homogeneous chips can provide a variety of capacity combinations, for example, two 256Mb chips push stack to a single 512Mb chip using the WSON8 8x6mm package. Of course, the W25M512JV can also provide the encapsulation of SOP16 and BGA24. Heterogeneous SpiStack products encapsulate NOR and NAND in the same package, for example, a 64Mb SPI NOR and a 1Gb Serial NAND. This allows system design users to have more flexibility in arranging the areas where code or data is stored.


Each sealed individual chip has a separate quality and specification, for example, up to 104Mhz and can be read with quad-spi. Depending on the requirements, you can combine either 16Mb to 2Gb of NOR or NAND memory at will. For example, the boot code can be stored in NOR, because it has better erasability, data saving features and faster random reading ability, while the relatively large data or as the backup area of the boot code can be stored on NAND. Because NAND is very fast to write, it is suitable for writing large data in real time and as a system backup area


W25M SpiStack Product Series

*Stack memory for various capacity combinations of Flash products

*Users can easily choose the size of the required capacity

*Standard SPI interface

*Compatible with existing SpiFlash

Homogenous push-up - two or more

*From 1Mb to 256m-bit NOR chip

*From 512Mb to 2Gb NAND chip

Heterogeneous stack - two or more

*NOR and NAND heterogeneous stack

synchronous operation

*One of the chips as reads, erase/write to another chip at the same time

Wide Application:

*Cell phone, camera, printer, server, set-top box

*Automotive, bluetooth, GPS, digital TV, audio source processing, FPGA

*Network, DSL, base station, industrial control, etc


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