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2Gb F-die DDR3L SDRAM x16

96FBGA with Lead-Free & Halogen-Free  (RoHS compliant)

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Products and specifications discussed herein are for reference purposes only. All information discussed  herein is provided on an "AS IS" basis, without warranties of any kind.  

This document and all information discussed herein remain the sole and exclusive property of Samsung  Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property  right is granted by one party to the other party under this document, by implication, estoppel or otherwise.  

Samsung products are not intended for use in life support, critical care, medical, safety equipment, or  similar applications where product failure could result in loss of life or personal or physical harm, or any  military or defense application, or any governmental procurement to which special terms or provisions  may apply.  

For updates or additional information about Samsung products, contact your nearest Samsung office.  

All brand names, trademarks and registered trademarks belong to their respective owners.

Key Features

• JEDEC standard 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V)  

• VDDQ = 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V)  

• 400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin,  667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin   933MHz fCK for 1866Mb/sec/pin  

• 8 Banks  

• Programmable CAS Latency(posted CAS): 5,6,7,8,9,10,11,13  

• Programmable Additive Latency: 0, CL-2 or CL-1 clock  

• Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6  (DDR3-1066), 7 (DDR3-1333), 8 (DDR3-1600) and 9(DDR3-1866)  

• 8-bit pre-fetch  

• Burst Length: 8 , 4 with tCCD = 4 which does not allow seamless read  or write [either On the fly using A12 or MRS]  

• Bi-directional Differential Data-Strobe  

• Internal(self) calibration : Internal self calibration through ZQ pin  (RZQ : 240 ohm ± 1%) 

 • On Die Termination using ODT pin  

• Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at  85C < TCASE < 95 C  

• Support Industrial Temp ( -4095C )   

- tREFI 7.8us at -40 °C ≤ TCASE ≤ 85°C   

- tREFI 3.9us at 85 °C < TCASE ≤ 95°C  

• Asynchronous Reset  

• Package : 96 balls FBGA - x16  

• All of Lead-Free products are compliant for RoHS  

• All of products are Halogen-free

The 2Gb DDR3 SDRAM F-die is organized as a 16Mbit x 16 I/Os x 8 banks  device. This synchronous device achieves high speed double-data-rate  transfer rates of up to 1866Mb/sec/pin (DDR3-1866) for general applications.   

The chip is designed to comply with the following key DDR3 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration,  On Die Termination using ODT pin and Asynchronous Reset .   

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a  pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion. The address bus is used to convey row, column, and bank address  information in a RAS/CAS multiplexing style. The DDR3 device operates  with a single 1.35V(1.28V~1.45V) or 1.5V(1.425V~1.575V) power supply  and 1.35V(1.28V~1.45V) or 1.5V(1.425V~1.575V) VDDQ.  

The 2Gb DDR3 F-die device is available in 96balls FBGA(x16).

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