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May 20, 2022Provide PHISON Finished Products
PS8317 UFS 2.2 Series specifications and functional features | |||
capacity | 64GB | 128GB | 256GB |
joggle | HS-G3x2 UFS 2.2 | HS-G3x2 UFS 2.2 | HS-G3x2 UFS 2.2 |
package | 153 Ball | 153 Ball | 153 Ball |
Flash Memory | 176 Layers | 176 Layers | 176 Layers |
Flash type | TLC | TLC | TLC |
potency | Up to R800/W400 | Up to R1000/W800 | Up to R1000/W950 |
Speed up the write-in device dimensions | 2GB | 4GB | 8GB |
Host performance booster | HPB2.0 | HPB2.0 | HPB2.0 |
Operating temperature: Grade2 / Grade3 / Industrial | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ |
Core Voltage, (VCC) | 3.3V | 3.3V | 3.3V |
I / O voltage (VCCQ) | 1.8V | 1.8V | 1.8V |
reliability | TLC：≥ 3K | TLC：≥ 3K | TLC：≥ 3K |
Data preservation period | 1year @ Life end | 1year @ Life end | 1year @ Life end |
PS8317 UFS 3.1 series specifications and functional features | |||
capacity | 64GB | 128GB | 256GB |
joggle | HS-G4x2 UFS 3.1 | HS-G4x2 UFS 3.1 | HS-G4x2 UFS 3.1 |
package | 153 Ball | 153 Ball | 153 Ball |
Flash Memory | 176 Layers | 176 Layers | 176 Layers |
Flash type | TLC | TLC | TLC |
potency | Up to R800/W420 | Up to R1500/W800 | Up to R1650/W1100 |
Speed up the write-in device dimensions | 2GB | 4GB | 8GB |
Host performance booster | HPB2.0 | HPB2.0 | HPB2.0 |
Operating temperature: Grade2 / Grade3 / Industrial | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ | ±40~105℃/±40~85℃ |
Core Voltage, (VCC) | 2.5V | 2.5V | 2.5V |
I / O voltage (VCCQ) | 1.2V | 1.2V | 1.2V |
reliability | TLC：≥ 3K | TLC：≥ 3K | TLC：≥ 3K |
Data preservation period | 1year @ Life end | 1year @ Life end | 1year @ Life end |
Embedded quotient gauge UFS 2.2 vs. 3.1 specifications are compared | ||
UFS 2.2 | UFS 3.1 | |
master control | PS8317 | PS8318 |
joggle | HS-G3x2 UFS 2.2 | HS-G3x2 UFS 3.1 |
Flash Memory | Micron 176L, 3D TLC, 512Gbit | Micron 176L, 3D TLC, 512Gbit |
capacity (GB) | 64/128/256GB | 128/256/512GB |
NAND channel, Maximum transmission rate | 2ch, 800MT/s | 2ch, up 1600MT/s or 4ch, up to 800MT/s |
Continuous read / Write performance (up to) | 1040/910 MB/s | 1900/1425 MB/s |
4K Random Read / Write Performance (up to) | 120K/175K IOPS | 200K/235K IOPS |
Effective Power, (RMS) | TBD | TBD |
Write to the acceleration technology | Supported | Supported |
HPB 2.0 | Supported | Supported |
Package type | BGA-153 | BGA-153 |
size (mm) | 11.5 x 13.0 | 11.5 x 13.0 |
Operating temperature | ±25°C to 85°C | ±25°C to 85°C |
Model number (PartNo.) | PSUF22H17-A064SS | PSUF31L18-A128SS |
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