Embedded Solid State Drive (SSD)

PHISON Embedded Solid State Drive (SSD)

May 17, 2022

Provide PHISON Finished Products

PHISON, the agent of indasina, specializes in flash memory technology, with more than 20 years of experience in flash memory master IC design, more than 2,000 flash memory related patents around the world, including related flash memory management technologies, rich and extensive industry application expertise, including embedded , Enterprise, Endpoint PC, and Mobile Device Applications PATA, SATA, PCIe NVMe, USB, SD, eMMC, UFS.

The PHISON PCIe embedded solution master specification
model	PS5012-E12DI	PS5018-E18DI	PS5013-E13TI	PS5021-E21TI
joggle	Gen 3x4 NVMe	Gen 4x4 NVMe	Gen 3x4 NVMe	Gen 4x4 NVMe
manufacture procedure	28nm	12nm	28nm	12 nm
Mass production time	MP	MP: Q2’22	MP	MP: Q2’22
DRAM	DDR4	DDR4	N/A	N/A
channel	8	8	4	4
Efficiency 1	3400/3100 MB/s 650K/650K IOPS	7200/6500 MB/s 750K/1000K IOPS	2500/1900 MB/s 270K/420K IOPS	3600/3000 MB/s 600K/310K IOPS
ECC machine-processed	LDPC Gen 3 + RAID	LDPC Gen 4 + RAID	LDPC Gen 4 + RAID	LDPC Gen 4 + RAID
CE count	64CE (Up to 16TB)	32CE (Up to 4TB)	16CE (Up to 2TB)	16CE (Up to 2TB)
Flash Memory	64L/96L/112L 3D TLC	112L 3D TLC	64L/96L/112L 3D TLC	112L/176L 3D TLC
Security encryption	TCG OPAL	TCG OPAL	TCG OPAL	TCG OPAL
Wide temperature	Support	Support	Support	Support
Product type	U.2/ M.2 2280/M.2 22110	M.2 2280	M.2 2280/2242/CFX/BGA SSD	M.2 2280/ 2230/ BGA SSD

The PHISON SATA embedded solution master specification
model	PS3111-S11T	PS3112-S12DI	PS3117-S17TI
joggle	SATA III	SATA III	SATA III
manufacture procedure	40nm	28nm	28nm
Mass production time	MP	MP	MP
DRAM	N/A	DDR4/DDR3L	N/A
channel	2	8	2
Efficiency 1	550/500 MB/s 90K/85K IOPS	550/530 MB/s 98K/90K IOPS	550/510 MB/s 95K/86K IOPS
ECC machine-processed	LDPC + RAID	LDPC + RAID	LDPC + RAID
CE count	16 (Up to 1TB)	32 (Up to 16TB)	16 (Up to 2TB)
Flash Memory	64L/96L/112L 3D TLC 2D MLC/ SLC	64L/96L/112L 3D TLC	112L 3D TLC
Security encryption	N/A	TCG OPAL	TCG OPAL
Wide temperature	Support	Support	Support
Product type	2.5”/M.2 2280/M.2 2242/mSATA/BGA SSD	2.5”/M.2 2280/M.2 2242	2.5”/M.2 2280/M.2 2242/mSATA/CFast

PHISON PCIe SSD Embedded Product Positioning
	normalized form		High-end type
master control	PS5013-E13TI	PS5021-E21TI	PS5012-E12DI	PS5018-E18DI
joggle	PCIe Gen3 x 4	PCIe Gen4 x 4	PCIe Gen3 x 4	PCIe Gen4 x 4
capacity	128GB – 2048GB	256-2048GB	240GB – 15360GB	480-3840GB
Memory / No-memory DRAM	DRAM-less	DRAM-less	DDR4	DDR4
Continuous read / write effectiveness	Burst Seq.2500/1900 MB/s	Burst Seq.3600/3000 MB/s	Burst Seq.3200/3000 MB/s1 Sustained Seq.3200/1000 MB/s	Burst Seq.7200/6500 MB/s1 Seq.w/o SLC cache : 6800/2400 MB/s
4K Random read / write performance	Burst Ran.270K/420K IOPS	Burst Ran.600K/310K IOPS	Burst Ran.700K/600K IOPS1 Sustained Ran.460K/30K IOPS	Burst Ran.750K/1000K IOPS1 Ran.w/o SLC cache 600K/300K IOPS
Average power consumption	Read: 4.0W Write: 3.5W	Read: 4.6W Write: 4.6W	Read: 9.0W Write: 6.6W	Read: 11.0W Write: 11.0W
Reliability (MTBF)	> 2,000,000	> 1,500,000	> 1,500,000	> 1,500,000
Reliability (TBW)	> 2,400 (base on 2048GB)	> 1,600 (base on 2048GB)	> 12,000 (base on 7680GB)	> 5,000 (base on 3840GB)
Security encryption	TCG OPAL	TCG OPAL	TCG OPAL	TCG OPAL
HW PLP Circuit	NA	NA	Support	NA
Product type	M.2 2242 / M.2 2280 /CFXTM / BGA SSD	M.2 2280/ 2230/ BGA SSD	M.2 2280 / M.2 22110 / U.2	M.2 2280

The PHISON PCIe Gen4 SSD Embedded Solution
model	E18DI M.2 2280	E21TI M.2 2280
joggle	Gen 4x4 NVMe1.4	Gen 4x4 NVMe1.4
Memory / No-memory DRAM	DDR4	DDR4-less
Flash combo architecture	X4 3D TLC NAND Flash Double side	X4 3D TLC NAND Flash Double side
main features	Higher-order PCIe Gen4 SSD High density PCIe SSD for data recording or edge computing storage	With Gen4 high performance and low consumption, suitable for a read or entry-level hybrid workload system The higher-order DRAM-less SSD of the No
capacity	480GB ~ 3840GB	256GB ~ 2048GB
potency	Seq.with SLC cache : 7200/6500 MB/s4 Seq.without SLC cache : 6800/2400 MB/s5	Seq.with SLC cache : 3600/3000 MB/s4 Seq.without SLC cache : 3200/1500 MB/s5
4KB randomization efficacy	Ran.with SLC cache : 750K/1000K IOPS4 Ran.without SLC cache : 600K/300K IOPS5	Ran.with SLC cache : 600K/310K IOPS4 Ran.without SLC cache : 350K/180K IOPS5
Hot transmission induction	Yes	Yes
Security encryption protection	TCG OPAL	TCG OPAL
HW PLP Circuit	X	X
Operating temperature	0~70℃ to -40~85℃	0~70℃ to -40~85℃

PHISON PCIe Gen3 SSD Embedded Solution (1 / 2)
model	E12DI U.2	E12DI M.2 22110	E12DI M.2 2280
joggle	Gen3x4 NVMe1.3	Gen3x4 NVMe1.3	Gen3x4 NVMe1.3
Memory / No-memory DRAM	DDR4	DDR4	DDR4
Flash combo architecture	X8/16 NAND Flash	X8 3D TLC NAND Flash	X4 3D TLC NAND Flash
main features	Outstanding stability performance, low latency Equipped with power outage protection mechanism to protect key data during unexpected power failure	Very large capacity of PCIe SSD, suitable for the endpoint computing unit	Advanced and higher-order PCIe SSD M for Hybrid Workload Units.2 Module
capacity	240GB ~ 15360GB	3840GB	240GB ~ 1920GB
potency	Burst Seq.3200/3000 MB/s4 Sustained Seq.3200/1000 MB/s (Default)	Burst Seq.3200/2800 MB/s Sustained Seq.3200/850 MB/s	Burst Seq.3200/3000 MB/s Sustained Seq.3000/1000 MB/s
4KB randomization efficacy	Burst Ran.700K/600K IOPS4 Sustained Ran.400K/30K IOPS (Default)	Burst Ran.680K/600K IOPS Sustained Ran.200K/20K IOPS	Burst Ran.490K/500K IOPS Sustained Ran.200K/20K IOPS
Hot transmission induction	Yes	Yes	Yes
Security encryption protection	TCG OPAL	TCG OPAL	TCG OPAL
HW PLP Circuit	Support	X	X
Operating temperature	0~70℃ ~ -40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃

PHISON PCIe Gen3 SSD Embedded Solution (2 / 2)
model	E13TI M.2 2280	E13TI M.2 2242	E13TI M.2 2242
Product type	M.2 2280-S2-M	M.2 2242-D2-M	M.2 2242-D2-B-M
joggle	Gen3x4 NVMe1.3	Gen3x4 NVMe1.3	Gen3x2 NVMe1.3
Memory / No-memory DRAM	DRAM-Less	DRAM-Less	DRAM-Less
Flash combo architecture	X4 3D TLC NAND Flash Single side	X4 3D TLC NAND Flash Double side	X4 3D TLC NAND Flash Double side
main features		Mainstream memory-free PCIe SSD s for embedded systems Suitable for read-intensive drives An all-round solid-state drive with both competitiveness and economic benefits
capacity	128GB ~ 2048GB	128GB ~ 2048GB	128GB ~ 2048GB
potency	2500/1900 MB/s	2500/1900 MB/s	1750/1600 MB/s
Hot transmission induction	Yes	Yes	Yes
Security encryption protection	TCG OPAL	TCG OPAL	TCG OPAL
Operating temperature	0~70℃ to -40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃

PHISON SATA SSD Embedded Product Positioning
	normalized form		High-end type
master control	PS3111-S11T	PS3117-S17TI	PS3112-S12DI
joggle	SATA Gen III	SATA Gen III	SATA Gen III
capacity	4GB – 1024GB	64GB – 2048GB	120GB – 15360GB
Memory / No-memory DRAM	DRAM-less	DRAM-less	DDR4/DDR3L
Continuous read / write effectiveness	550/500 MB/s	550/510 MB/s	550/530 MB/s
4K Random read / write performance	Burst Ran.79K/89K IOPS1	Burst Ran.95K/86K IOPS	Burst Ran.98K/90K IOPS1 Sustained Ran.98K/20K IOPS
Average power consumption	Read: 2.0W Write: 2.1W	Read: 1.6W Write: 1.8W	Read: 4.0W Write: 5.0W
Reliability (MTBF)	> 2,000,000	> 2,500,000	> 1,500,000
Reliability (TBW)	> 800 (base on 1024GB)	> 2,900 (based on 2048GB)	> 12,000 (base on 7680GB)
Security encryption	NA	TCG OPAL	TCG OPAL
HW PLP Circuit	NA	NA	Support
Product type	mSATA/ mSATA-mini / Cfast / M.2 series / BGA SSD / 2.5”	2.5” / M.2 2280 / M.2 2242 / mSATA / CFast	M.2 2280 / M.2 2242 / 2.5”

PHISON SATA SSD Embedded Solution (1 / 3)
model	S12DI 2.5”	S12DI M.2 2280	S12DI M.2 2280	S12DI M.2 2242
Memory / No-memory DRAM	DDR4/DDR3L	DDR4	DDR4	DDR4
Flash combo architecture	X4/8/16 NAND Flash 3D TLC	X2/4 NAND Flash 3D TLC	X2 NAND Flash 3D TLC	X1 NAND Flash 3D TLC
main features	High-density and stable performance, used for monitoring or Data records of the edge calculations	Optimized hardware with firmware provides reliable video recording and To prevent off the grid	M with a PLP power-off protection mechanism.2 Module, Protect critical data and data during an unexpected power failure	The small module provides a power-off protection mechanism Suitable for boot device
capacity	120GB ~ 15360GB	120GB ~ 1920GB	240GB ~ 960GB	120GB ~ 480GB
potency	Max 550/530 MB/s	Max 550/530 MB/s	Max 550/530 MB/s	Max 550/490 MB/s
Hot transmission induction	Yes	Yes	Yes	Yes
HW PLP circuit	Support	X	Support	Support
GPIO WP/QE	Support	Support	X	X
Security encryption protection	TCG OPAL	TCG OPAL	TCG OPAL	TCG OPAL
Operating temperature	0~70℃ to -40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃

PHISON SATA SSD Embedded Solution (2 / 3)
model	S17TI 2.5”	S17TI M.2 2280	S17TI M.2 2242	S17TI mSATA
Memory / No-memory DRAM	DRAM-Less	DRAM-Less	DRAM-Less	DRAM-Less
Flash combo architecture	X1/2/4 NAND Flash 3D TLC	X1/2/4 NAND Flash 3D TLC	X1/2 NAND Flash 3D TLC	X1/2/4 NAND Flash 3D TLC
main features	Mainstream and cost-effective memory-free SSD solution designed for embedded devices Competitive moment performance and low power consumption.Can support the latest generation of flash memory Suitable for IPC startup devices and read-intensive devices, with AES / OPAL capabilities
capacity	64GB-2048GB	64GB ~ 2048GB	64GB ~ 1024GB	64GB ~ 2048GB
potency	Max 550/510 MB/s	Max 550/510 MB/s	Max 550/510 MB/s	Max 550/510 MB/s
Hot transmission induction	Yes (External Sensor)	Yes (External Sensor)	Yes (Internal Sensor)	Yes (Internal Sensor)
HW PLP circuit	X	X	X	X
Data WP/Erase	Support	Support	Support	Support
Security encryption protection	TCG OPAL	TCG OPAL	TCG OPAL	TCG OPAL
Operating temperature	0~70℃ to -40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃

PHISON SATA SSD Embedded Solution (3 / 3)
model	S11T 2.5” / mSATA / M.2 2280	S11T M.2 2242
Memory / No-memory DRAM	DRAM-Less	DRAM-Less
Flash combo architecture	X4 NAND Flash 2D MLC/SLC/3D TLC	X2 NAND Flash 2D MLC/SLC/3D TLC
main features	Both 2D to 3D TLC can be matched, with competitive instant performance and low power consumption Suitable for the traditional type of boot device
capacity	4GB ~ 1024GB	4GB ~ 512GB
potency	Max 550/500 MB/s	Max 550/500 MB/s
Hot transmission induction	Yes	Yes
HW PLP circuit	X	X
Data WP/Erase	Support	X
Security encryption protection	X	X
Operating temperature	±40~85℃	±40~85℃

PHISON CFast (SATA) / CFX (PCIe) Embedded solution
model	S11T CFast	S17TI CFast	E13TI CFXTM
joggle	SATA III and backward, 2CH	SATA III and backward, 2CH	Gen3x2 NVMe, 4CH
size	42.8 x 36.4 x 3.3 mm	42.8 x 36.4 x 3.3 mm	38.5 x 29.6 x 3.8mm (Type B)
Flash combo architecture	X1/2 NAND Flash 2D MLC/SLC/3D TLC	X2 NAND Flash 3D TLC	X4 NAND Flash 3D TLC
main features	Detachable and low-power SATA storage device	Detachable type with low power consumption and safety features SATA memory	Competitive all-directional solid state drive for boot units With a hybrid working storage
capacity	8GB ~ 512GB	64GB ~ 512GB	128GB ~ 1024GB
potency	Max 550/490 MB/s	Max 550/500 MB/s	Max 1700/1600 MB/s
Thermal transfer induction 3	Yes	Yes (Internal Sensor)	Yes
Security encryption protection	NA	TCG OPAL	TCG OPAL
Operating temperature 4	±40~85℃	0~70℃ to -40~85℃	0~70℃ to -40~85℃