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PHISON FLASH

/PHISON Embedded Solid State Drive (SSD)

PHISON Embedded Solid State Drive (SSD)

May 17, 2022

PHISON, the agent of indasina, specializes in flash memory technology, with more than 20 years of experience in flash memory master IC design, more than 2,000 flash memory related patents around the world, including related flash memory management technologies, rich and extensive industry application expertise, including embedded , Enterprise, Endpoint PC, and Mobile Device Applications PATA, SATA, PCIe NVMe, USB, SD, eMMC, UFS.


The PHISON PCIe embedded solution master specification

model

PS5012-E12DI

PS5018-E18DI

PS5013-E13TI

PS5021-E21TI

joggle

Gen 3x4 NVMe

Gen 4x4 NVMe

Gen 3x4 NVMe

Gen 4x4 NVMe

manufacture procedure

28nm

12nm

28nm

12 nm

Mass production time

MP

MP: Q2’22

MP

MP: Q2’22

DRAM

DDR4

DDR4

N/A

N/A

channel

8

8

4

4

Efficiency 1

3400/3100 MB/s
650K/650K IOPS

7200/6500 MB/s
750K/1000K IOPS

2500/1900 MB/s
270K/420K IOPS

3600/3000 MB/s
600K/310K IOPS

ECC machine-processed

LDPC Gen 3 + RAID

LDPC Gen 4 + RAID

LDPC Gen 4 + RAID

LDPC Gen 4 + RAID

CE count

64CE (Up to 16TB)

32CE (Up to 4TB)

16CE (Up to 2TB)

16CE (Up to 2TB)

Flash Memory

64L/96L/112L 3D TLC

112L 3D TLC

64L/96L/112L 3D TLC

112L/176L 3D TLC

Security encryption

TCG OPAL

TCG OPAL

TCG OPAL

TCG OPAL

Wide temperature

Support

Support

Support

Support

Product type

U.2/ M.2 2280/M.2 22110

M.2 2280

M.2 2280/2242/CFX/BGA SSD

M.2 2280/ 2230/ BGA SSD


The PHISON SATA embedded solution master specification

model

PS3111-S11T

PS3112-S12DI

PS3117-S17TI

joggle

SATA III

SATA III

SATA III

manufacture procedure

40nm

28nm

28nm

Mass production time

MP

MP

MP

DRAM

N/A

DDR4/DDR3L

N/A

channel

2

8

2

Efficiency 1

550/500 MB/s
90K/85K IOPS

550/530 MB/s
98K/90K IOPS

550/510 MB/s
95K/86K IOPS

ECC machine-processed

LDPC + RAID

LDPC + RAID

LDPC + RAID

CE count

16 (Up to 1TB)

32 (Up to 16TB)

16 (Up to 2TB)

Flash Memory

64L/96L/112L 3D TLC
2D MLC/ SLC

64L/96L/112L 3D TLC

112L 3D TLC

Security encryption

N/A

TCG OPAL

TCG OPAL

Wide temperature

Support

Support

Support

Product type

2.5”/M.2 2280/M.2 2242/mSATA/BGA SSD

2.5”/M.2 2280/M.2 2242

2.5”/M.2 2280/M.2 2242/mSATA/CFast

   A.png 

PHISON PCIe SSD Embedded Product Positioning


normalized form

High-end type

master control

PS5013-E13TI

PS5021-E21TI

PS5012-E12DI

PS5018-E18DI

joggle

PCIe Gen3 x 4

PCIe Gen4 x 4

PCIe Gen3 x 4

PCIe Gen4 x 4

capacity

128GB – 2048GB

256-2048GB

240GB – 15360GB

480-3840GB

Memory / No-memory DRAM

DRAM-less

DRAM-less

DDR4

DDR4

Continuous read / write effectiveness

Burst Seq.2500/1900 MB/s

Burst Seq.3600/3000 MB/s

Burst Seq.3200/3000 MB/s1
Sustained Seq.3200/1000 MB/s

Burst Seq.7200/6500 MB/s1
Seq.w/o SLC cache : 6800/2400 MB/s

4K Random read / write performance

Burst Ran.270K/420K IOPS

Burst Ran.600K/310K IOPS

Burst Ran.700K/600K IOPS1
Sustained Ran.460K/30K IOPS

Burst Ran.750K/1000K IOPS1
Ran.w/o SLC cache 600K/300K IOPS

Average power consumption

Read: 4.0W
Write: 3.5W

Read: 4.6W
Write: 4.6W

Read: 9.0W
Write: 6.6W

Read: 11.0W
Write: 11.0W

Reliability (MTBF)

> 2,000,000

> 1,500,000

> 1,500,000

> 1,500,000

Reliability (TBW)

> 2,400 (base on 2048GB)

> 1,600 (base on 2048GB)

> 12,000 (base on 7680GB)

> 5,000 (base on 3840GB)

Security encryption

TCG OPAL

TCG OPAL

TCG OPAL

TCG OPAL

HW PLP Circuit

NA

NA

Support

NA

Product type

M.2 2242 / M.2 2280 /CFXTM
/ BGA SSD

M.2 2280/ 2230/ BGA SSD

M.2 2280 / M.2 22110 / U.2

M.2 2280

 

The PHISON PCIe Gen4 SSD Embedded Solution

model

E18DI
M.2 2280

E21TI
M.2 2280

joggle

Gen 4x4 NVMe1.4

Gen 4x4 NVMe1.4

Memory / No-memory DRAM

DDR4

DDR4-less

Flash combo architecture

X4 3D TLC NAND Flash
Double side

X4 3D TLC NAND Flash
Double side

main features

Higher-order PCIe Gen4 SSD
High density PCIe SSD for data recording or edge computing storage

With Gen4 high performance and low consumption, suitable for a read or entry-level hybrid workload system
The higher-order DRAM-less SSD of the No

capacity

480GB ~ 3840GB

256GB ~ 2048GB

potency

Seq.with SLC cache : 7200/6500 MB/s4
Seq.without SLC cache : 6800/2400 MB/s5

Seq.with SLC cache : 3600/3000 MB/s4
Seq.without SLC cache : 3200/1500 MB/s5

4KB randomization efficacy

Ran.with SLC cache : 750K/1000K IOPS4
Ran.without SLC cache : 600K/300K IOPS5

Ran.with SLC cache : 600K/310K IOPS4
Ran.without SLC cache : 350K/180K IOPS5

Hot transmission induction

Yes

Yes

Security encryption protection

TCG OPAL

TCG OPAL

HW PLP Circuit

X

X

Operating temperature

0~70℃ to -40~85℃

0~70℃ to -40~85℃

 

PHISON PCIe Gen3 SSD Embedded Solution (1 / 2)

model

E12DI
U.2

E12DI
M.2 22110

E12DI
M.2 2280

joggle

Gen3x4 NVMe1.3

Gen3x4 NVMe1.3

Gen3x4 NVMe1.3

Memory / No-memory DRAM

DDR4

DDR4

DDR4

Flash combo architecture

X8/16 NAND Flash

X8 3D TLC NAND Flash

X4 3D TLC NAND Flash

main features

Outstanding stability performance, low latency
Equipped with power outage protection mechanism to protect key data during unexpected power failure

Very large capacity of PCIe SSD, suitable for the endpoint computing unit

Advanced and higher-order PCIe SSD
M for Hybrid Workload Units.2 Module

capacity

240GB ~ 15360GB

3840GB

240GB ~ 1920GB

potency

Burst Seq.3200/3000 MB/s4
Sustained Seq.3200/1000 MB/s (Default)

Burst Seq.3200/2800 MB/s
Sustained Seq.3200/850 MB/s

Burst Seq.3200/3000 MB/s
Sustained Seq.3000/1000 MB/s

4KB randomization efficacy

Burst Ran.700K/600K IOPS4
Sustained Ran.400K/30K IOPS (Default)

Burst Ran.680K/600K IOPS
Sustained Ran.200K/20K IOPS

Burst Ran.490K/500K IOPS
Sustained Ran.200K/20K IOPS

Hot transmission induction

Yes

Yes

Yes

Security encryption protection

TCG OPAL

TCG OPAL

TCG OPAL

HW PLP Circuit

Support

X

X

Operating temperature

0~70℃ ~ -40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃

 

PHISON PCIe Gen3 SSD Embedded Solution (2 / 2)

model

E13TI
M.2 2280

E13TI
M.2 2242

E13TI
M.2 2242

Product type

M.2 2280-S2-M

M.2 2242-D2-M

M.2 2242-D2-B-M

joggle

Gen3x4 NVMe1.3

Gen3x4 NVMe1.3

Gen3x2 NVMe1.3

Memory / No-memory DRAM

DRAM-Less

DRAM-Less

DRAM-Less

Flash combo architecture

X4 3D TLC NAND Flash
Single side

X4 3D TLC NAND Flash
Double side

X4 3D TLC NAND Flash
Double side

main features


Mainstream memory-free PCIe SSD s for embedded systems
Suitable for read-intensive drives
An all-round solid-state drive with both competitiveness and economic benefits


capacity

128GB ~ 2048GB

128GB ~ 2048GB

128GB ~ 2048GB

potency

2500/1900 MB/s

2500/1900 MB/s

1750/1600 MB/s

Hot transmission induction

Yes

Yes

Yes

Security encryption protection

TCG OPAL

TCG OPAL

TCG OPAL

Operating temperature

0~70℃ to -40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃

   B.png 

PHISON SATA SSD Embedded Product Positioning


normalized form

High-end type

master control

PS3111-S11T

PS3117-S17TI

PS3112-S12DI

joggle

SATA Gen III

SATA Gen III

SATA Gen III

capacity

4GB – 1024GB

64GB – 2048GB

120GB – 15360GB

Memory / No-memory DRAM

DRAM-less

DRAM-less

DDR4/DDR3L

Continuous read / write effectiveness

550/500 MB/s

550/510 MB/s

550/530 MB/s

4K Random read / write performance

Burst Ran.79K/89K IOPS1

Burst Ran.95K/86K IOPS

Burst Ran.98K/90K IOPS1
Sustained Ran.98K/20K IOPS

Average power consumption

Read: 2.0W
Write: 2.1W

Read: 1.6W
Write: 1.8W

Read: 4.0W
Write: 5.0W

Reliability (MTBF)

> 2,000,000

> 2,500,000

> 1,500,000

Reliability (TBW)

> 800 (base on 1024GB)

> 2,900 (based on 2048GB)

> 12,000 (base on 7680GB)

Security encryption

NA

TCG OPAL

TCG OPAL

HW PLP Circuit

NA

NA

Support

Product type

mSATA/ mSATA-mini / Cfast / M.2 series /
BGA SSD / 2.5”

2.5” / M.2 2280 / M.2 2242 / mSATA / CFast

M.2 2280 / M.2 2242 / 2.5”

 

PHISON SATA SSD Embedded Solution (1 / 3)

model

S12DI
2.5”

S12DI
M.2 2280

S12DI
M.2 2280

S12DI
M.2 2242

Memory / No-memory DRAM

DDR4/DDR3L

DDR4

DDR4

DDR4

Flash combo architecture

X4/8/16 NAND Flash
3D TLC

X2/4 NAND Flash
3D TLC

X2 NAND Flash
3D TLC

X1 NAND Flash
3D TLC

main features

High-density and stable performance, used for monitoring or
Data records of the edge calculations

Optimized hardware with firmware provides reliable video recording and
To prevent off the grid

M with a PLP power-off protection mechanism.2 Module,
Protect critical data and data during an unexpected power failure

The small module provides a power-off protection mechanism
Suitable for boot device

capacity

120GB ~ 15360GB

120GB ~ 1920GB

240GB ~ 960GB

120GB ~ 480GB

potency

Max 550/530 MB/s

Max 550/530 MB/s

Max 550/530 MB/s

Max 550/490 MB/s

Hot transmission induction

Yes

Yes

Yes

Yes

HW PLP circuit

Support

X

Support

Support

GPIO WP/QE

Support

Support

X

X

Security encryption protection

TCG OPAL

TCG OPAL

TCG OPAL

TCG OPAL

Operating temperature

0~70℃ to -40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃

 

PHISON SATA SSD Embedded Solution (2 / 3)

model

S17TI
2.5”

S17TI
M.2 2280

S17TI
M.2 2242

S17TI
mSATA

Memory / No-memory DRAM

DRAM-Less

DRAM-Less

DRAM-Less

DRAM-Less

Flash combo architecture

X1/2/4 NAND Flash
3D TLC

X1/2/4 NAND Flash
3D TLC

X1/2 NAND Flash
3D TLC

X1/2/4 NAND Flash
3D TLC

main features

Mainstream and cost-effective memory-free SSD solution designed for embedded devices
Competitive moment performance and low power consumption.Can support the latest generation of flash memory
Suitable for IPC startup devices and read-intensive devices, with AES / OPAL capabilities

capacity

64GB-2048GB

64GB ~ 2048GB

64GB ~ 1024GB

64GB ~ 2048GB

potency

Max 550/510 MB/s

Max 550/510 MB/s

Max 550/510 MB/s

Max 550/510 MB/s

Hot transmission induction

Yes (External Sensor)

Yes (External Sensor)

Yes (Internal Sensor)

Yes (Internal Sensor)

HW PLP circuit

X

X

X

X

Data WP/Erase

Support

Support

Support

Support

Security encryption protection

TCG OPAL

TCG OPAL

TCG OPAL

TCG OPAL

Operating temperature

0~70℃ to -40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃

 

PHISON SATA SSD Embedded Solution (3 / 3)

model

S11T
2.5” / mSATA / M.2 2280

S11T
M.2 2242

Memory / No-memory DRAM

DRAM-Less

DRAM-Less

Flash combo architecture

X4 NAND Flash
2D MLC/SLC/3D TLC

X2 NAND Flash
2D MLC/SLC/3D TLC

main features

Both 2D to 3D TLC can be matched, with competitive instant performance and low power consumption
Suitable for the traditional type of boot device

capacity

4GB ~ 1024GB

4GB ~ 512GB

potency

Max 550/500 MB/s

Max 550/500 MB/s

Hot transmission induction

Yes

Yes

HW PLP circuit

X

X

Data WP/Erase

Support

X

Security encryption protection

X

X

Operating temperature

±40~85℃

±40~85℃

 

PHISON CFast (SATA) / CFX (PCIe) Embedded solution

model

S11T
CFast

S17TI
CFast

E13TI
CFXTM

joggle

SATA III and backward, 2CH

SATA III and backward, 2CH

Gen3x2 NVMe, 4CH

size

42.8 x 36.4 x 3.3 mm

42.8 x 36.4 x 3.3 mm

38.5 x 29.6 x 3.8mm (Type B)

Flash combo architecture

X1/2 NAND Flash
2D MLC/SLC/3D TLC

X2 NAND Flash
3D TLC

X4 NAND Flash
3D TLC

main features

Detachable and low-power SATA storage device

Detachable type with low power consumption and safety features
SATA memory

Competitive all-directional solid state drive for boot units
With a hybrid working storage

capacity

8GB ~ 512GB

64GB ~ 512GB

128GB ~ 1024GB

potency

Max 550/490 MB/s

Max 550/500 MB/s

Max 1700/1600 MB/s

Thermal transfer induction 3

Yes

Yes (Internal Sensor)

Yes

Security encryption protection

NA

TCG OPAL

TCG OPAL

Operating temperature 4

±40~85℃

0~70℃ to -40~85℃

0~70℃ to -40~85℃


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