Provide PHISON Finished Products
PHISON, the agent of indasina, specializes in flash memory technology, with more than 20 years of experience in flash memory master IC design, more than 2,000 flash memory related patents around the world, including related flash memory management technologies, rich and extensive industry application expertise, including embedded , Enterprise, Endpoint PC, and Mobile Device Applications PATA, SATA, PCIe NVMe, USB, SD, eMMC, UFS.
The PHISON PCIe embedded solution master specification | ||||
model | PS5012-E12DI | PS5018-E18DI | PS5013-E13TI | PS5021-E21TI |
joggle | Gen 3x4 NVMe | Gen 4x4 NVMe | Gen 3x4 NVMe | Gen 4x4 NVMe |
manufacture procedure | 28nm | 12nm | 28nm | 12 nm |
Mass production time | MP | MP: Q2’22 | MP | MP: Q2’22 |
DRAM | DDR4 | DDR4 | N/A | N/A |
channel | 8 | 8 | 4 | 4 |
Efficiency 1 | 3400/3100 MB/s | 7200/6500 MB/s | 2500/1900 MB/s | 3600/3000 MB/s |
ECC machine-processed | LDPC Gen 3 + RAID | LDPC Gen 4 + RAID | LDPC Gen 4 + RAID | LDPC Gen 4 + RAID |
CE count | 64CE (Up to 16TB) | 32CE (Up to 4TB) | 16CE (Up to 2TB) | 16CE (Up to 2TB) |
Flash Memory | 64L/96L/112L 3D TLC | 112L 3D TLC | 64L/96L/112L 3D TLC | 112L/176L 3D TLC |
Security encryption | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
Wide temperature | Support | Support | Support | Support |
Product type | U.2/ M.2 2280/M.2 22110 | M.2 2280 | M.2 2280/2242/CFX/BGA SSD | M.2 2280/ 2230/ BGA SSD |
The PHISON SATA embedded solution master specification | |||
model | PS3111-S11T | PS3112-S12DI | PS3117-S17TI |
joggle | SATA III | SATA III | SATA III |
manufacture procedure | 40nm | 28nm | 28nm |
Mass production time | MP | MP | MP |
DRAM | N/A | DDR4/DDR3L | N/A |
channel | 2 | 8 | 2 |
Efficiency 1 | 550/500 MB/s | 550/530 MB/s | 550/510 MB/s |
ECC machine-processed | LDPC + RAID | LDPC + RAID | LDPC + RAID |
CE count | 16 (Up to 1TB) | 32 (Up to 16TB) | 16 (Up to 2TB) |
Flash Memory | 64L/96L/112L 3D TLC | 64L/96L/112L 3D TLC | 112L 3D TLC |
Security encryption | N/A | TCG OPAL | TCG OPAL |
Wide temperature | Support | Support | Support |
Product type | 2.5”/M.2 2280/M.2 2242/mSATA/BGA SSD | 2.5”/M.2 2280/M.2 2242 | 2.5”/M.2 2280/M.2 2242/mSATA/CFast |
PHISON PCIe SSD Embedded Product Positioning | ||||
normalized form | High-end type | |||
master control | PS5013-E13TI | PS5021-E21TI | PS5012-E12DI | PS5018-E18DI |
joggle | PCIe Gen3 x 4 | PCIe Gen4 x 4 | PCIe Gen3 x 4 | PCIe Gen4 x 4 |
capacity | 128GB – 2048GB | 256-2048GB | 240GB – 15360GB | 480-3840GB |
Memory / No-memory DRAM | DRAM-less | DRAM-less | DDR4 | DDR4 |
Continuous read / write effectiveness | Burst Seq.2500/1900 MB/s | Burst Seq.3600/3000 MB/s | Burst Seq.3200/3000 MB/s1 | Burst Seq.7200/6500 MB/s1 |
4K Random read / write performance | Burst Ran.270K/420K IOPS | Burst Ran.600K/310K IOPS | Burst Ran.700K/600K IOPS1 | Burst Ran.750K/1000K IOPS1 |
Average power consumption | Read: 4.0W | Read: 4.6W | Read: 9.0W | Read: 11.0W |
Reliability (MTBF) | > 2,000,000 | > 1,500,000 | > 1,500,000 | > 1,500,000 |
Reliability (TBW) | > 2,400 (base on 2048GB) | > 1,600 (base on 2048GB) | > 12,000 (base on 7680GB) | > 5,000 (base on 3840GB) |
Security encryption | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
HW PLP Circuit | NA | NA | Support | NA |
Product type | M.2 2242 / M.2 2280 /CFXTM | M.2 2280/ 2230/ BGA SSD | M.2 2280 / M.2 22110 / U.2 | M.2 2280 |
The PHISON PCIe Gen4 SSD Embedded Solution | ||
model | E18DI | E21TI |
joggle | Gen 4x4 NVMe1.4 | Gen 4x4 NVMe1.4 |
Memory / No-memory DRAM | DDR4 | DDR4-less |
Flash combo architecture | X4 3D TLC NAND Flash | X4 3D TLC NAND Flash |
main features | Higher-order PCIe Gen4 SSD | With Gen4 high performance and low consumption, suitable for a read or entry-level hybrid workload system |
capacity | 480GB ~ 3840GB | 256GB ~ 2048GB |
potency | Seq.with SLC cache : 7200/6500 MB/s4 | Seq.with SLC cache : 3600/3000 MB/s4 |
4KB randomization efficacy | Ran.with SLC cache : 750K/1000K IOPS4 | Ran.with SLC cache : 600K/310K IOPS4 |
Hot transmission induction | Yes | Yes |
Security encryption protection | TCG OPAL | TCG OPAL |
HW PLP Circuit | X | X |
Operating temperature | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
PHISON PCIe Gen3 SSD Embedded Solution (1 / 2) | |||
model | E12DI | E12DI | E12DI |
joggle | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 |
Memory / No-memory DRAM | DDR4 | DDR4 | DDR4 |
Flash combo architecture | X8/16 NAND Flash | X8 3D TLC NAND Flash | X4 3D TLC NAND Flash |
main features | Outstanding stability performance, low latency | Very large capacity of PCIe SSD, suitable for the endpoint computing unit | Advanced and higher-order PCIe SSD |
capacity | 240GB ~ 15360GB | 3840GB | 240GB ~ 1920GB |
potency | Burst Seq.3200/3000 MB/s4 | Burst Seq.3200/2800 MB/s | Burst Seq.3200/3000 MB/s |
4KB randomization efficacy | Burst Ran.700K/600K IOPS4 | Burst Ran.680K/600K IOPS | Burst Ran.490K/500K IOPS |
Hot transmission induction | Yes | Yes | Yes |
Security encryption protection | TCG OPAL | TCG OPAL | TCG OPAL |
HW PLP Circuit | Support | X | X |
Operating temperature | 0~70℃ ~ -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
PHISON PCIe Gen3 SSD Embedded Solution (2 / 2) | |||
model | E13TI | E13TI | E13TI |
Product type | M.2 2280-S2-M | M.2 2242-D2-M | M.2 2242-D2-B-M |
joggle | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 | Gen3x2 NVMe1.3 |
Memory / No-memory DRAM | DRAM-Less | DRAM-Less | DRAM-Less |
Flash combo architecture | X4 3D TLC NAND Flash | X4 3D TLC NAND Flash | X4 3D TLC NAND Flash |
main features | Mainstream memory-free PCIe SSD s for embedded systems | ||
capacity | 128GB ~ 2048GB | 128GB ~ 2048GB | 128GB ~ 2048GB |
potency | 2500/1900 MB/s | 2500/1900 MB/s | 1750/1600 MB/s |
Hot transmission induction | Yes | Yes | Yes |
Security encryption protection | TCG OPAL | TCG OPAL | TCG OPAL |
Operating temperature | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
PHISON SATA SSD Embedded Product Positioning | |||
normalized form | High-end type | ||
master control | PS3111-S11T | PS3117-S17TI | PS3112-S12DI |
joggle | SATA Gen III | SATA Gen III | SATA Gen III |
capacity | 4GB – 1024GB | 64GB – 2048GB | 120GB – 15360GB |
Memory / No-memory DRAM | DRAM-less | DRAM-less | DDR4/DDR3L |
Continuous read / write effectiveness | 550/500 MB/s | 550/510 MB/s | 550/530 MB/s |
4K Random read / write performance | Burst Ran.79K/89K IOPS1 | Burst Ran.95K/86K IOPS | Burst Ran.98K/90K IOPS1 |
Average power consumption | Read: 2.0W | Read: 1.6W | Read: 4.0W |
Reliability (MTBF) | > 2,000,000 | > 2,500,000 | > 1,500,000 |
Reliability (TBW) | > 800 (base on 1024GB) | > 2,900 (based on 2048GB) | > 12,000 (base on 7680GB) |
Security encryption | NA | TCG OPAL | TCG OPAL |
HW PLP Circuit | NA | NA | Support |
Product type | mSATA/ mSATA-mini / Cfast / M.2 series / | 2.5” / M.2 2280 / M.2 2242 / mSATA / CFast | M.2 2280 / M.2 2242 / 2.5” |
PHISON SATA SSD Embedded Solution (1 / 3) | ||||
model | S12DI | S12DI | S12DI | S12DI |
Memory / No-memory DRAM | DDR4/DDR3L | DDR4 | DDR4 | DDR4 |
Flash combo architecture | X4/8/16 NAND Flash | X2/4 NAND Flash | X2 NAND Flash | X1 NAND Flash |
main features | High-density and stable performance, used for monitoring or | Optimized hardware with firmware provides reliable video recording and | M with a PLP power-off protection mechanism.2 Module, | The small module provides a power-off protection mechanism |
capacity | 120GB ~ 15360GB | 120GB ~ 1920GB | 240GB ~ 960GB | 120GB ~ 480GB |
potency | Max 550/530 MB/s | Max 550/530 MB/s | Max 550/530 MB/s | Max 550/490 MB/s |
Hot transmission induction | Yes | Yes | Yes | Yes |
HW PLP circuit | Support | X | Support | Support |
GPIO WP/QE | Support | Support | X | X |
Security encryption protection | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
Operating temperature | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
PHISON SATA SSD Embedded Solution (2 / 3) | ||||
model | S17TI | S17TI | S17TI | S17TI |
Memory / No-memory DRAM | DRAM-Less | DRAM-Less | DRAM-Less | DRAM-Less |
Flash combo architecture | X1/2/4 NAND Flash | X1/2/4 NAND Flash | X1/2 NAND Flash | X1/2/4 NAND Flash |
main features | Mainstream and cost-effective memory-free SSD solution designed for embedded devices | |||
capacity | 64GB-2048GB | 64GB ~ 2048GB | 64GB ~ 1024GB | 64GB ~ 2048GB |
potency | Max 550/510 MB/s | Max 550/510 MB/s | Max 550/510 MB/s | Max 550/510 MB/s |
Hot transmission induction | Yes (External Sensor) | Yes (External Sensor) | Yes (Internal Sensor) | Yes (Internal Sensor) |
HW PLP circuit | X | X | X | X |
Data WP/Erase | Support | Support | Support | Support |
Security encryption protection | TCG OPAL | TCG OPAL | TCG OPAL | TCG OPAL |
Operating temperature | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
PHISON SATA SSD Embedded Solution (3 / 3) | ||
model | S11T | S11T |
Memory / No-memory DRAM | DRAM-Less | DRAM-Less |
Flash combo architecture | X4 NAND Flash | X2 NAND Flash |
main features | Both 2D to 3D TLC can be matched, with competitive instant performance and low power consumption | |
capacity | 4GB ~ 1024GB | 4GB ~ 512GB |
potency | Max 550/500 MB/s | Max 550/500 MB/s |
Hot transmission induction | Yes | Yes |
HW PLP circuit | X | X |
Data WP/Erase | Support | X |
Security encryption protection | X | X |
Operating temperature | ±40~85℃ | ±40~85℃ |
PHISON CFast (SATA) / CFX (PCIe) Embedded solution | |||
model | S11T | S17TI | E13TI |
joggle | SATA III and backward, 2CH | SATA III and backward, 2CH | Gen3x2 NVMe, 4CH |
size | 42.8 x 36.4 x 3.3 mm | 42.8 x 36.4 x 3.3 mm | 38.5 x 29.6 x 3.8mm (Type B) |
Flash combo architecture | X1/2 NAND Flash | X2 NAND Flash | X4 NAND Flash |
main features | Detachable and low-power SATA storage device | Detachable type with low power consumption and safety features | Competitive all-directional solid state drive for boot units |
capacity | 8GB ~ 512GB | 64GB ~ 512GB | 128GB ~ 1024GB |
potency | Max 550/490 MB/s | Max 550/500 MB/s | Max 1700/1600 MB/s |
Thermal transfer induction 3 | Yes | Yes (Internal Sensor) | Yes |
Security encryption protection | NA | TCG OPAL | TCG OPAL |
Operating temperature 4 | ±40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
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