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PHISON Embedded eMMC

May 19, 2022

Provide PHISON Finished Products


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Small and stable and can be applied to  the design of various embedded systems


PHISON's eMMC is based on JEDEC standard eMMC 4.5/5.0/5.1 and has 100/153 balls, which can be securely mounted on the board to prevent vibration.


Page-based firmware architecture speeds up system runtime and improves durability.


It has a capacity of up to 128GB and supports (-40~105°C) AEC Grade2, (-40~85°C) AEC Grade3 and the temperature range of industrial-grade verification specifications, suitable for use in various embedded application systems.


Support printing customized eMMC logo.



PS8225 Series specifications and functional features

capacity

4GB

8GB

joggle

eMMC 5.0 HS400

eMMC 5.0 HS400

package

153 Ball
(11.5x13x1.0mm)
100Ball
(14x18x1.4mm)

153 Ball
(11.5x13x1.0mm)
100Ball
(14x18x1.4mm)

Flash Memory

2D

2D

Flash type

pSLC

MLC

potency
Continuous Read / Write (MB/s)

Up to 250/80

Up to 250/60

Operating temperature is Grade2 / Grade3 / Industrial

±40~105℃/±40~85℃

±40~105℃/±40~85℃

Core Voltage, (VCC)

3.3V

3.3V

I / O voltage (VCCQ)

1.8V or 3.3V

1.8V or 3.3V

reliability
W/E Endurance

pSLC:30K

MLC:≥ 3K

Data preservation period

1year @ Life end
10years @ initial

1year @ Life end
10years @ initial



PS8229 Series specifications and functional features

capacity

16GB

32GB

joggle

eMMC 5.1 HS400

eMMC 5.1 HS400

package

153 Ball
(11.5x13x1.0mm)

153 Ball
(11.5x13x1.0mm)

Flash Memory

64 Layers

64 Layers

Flash type

pSLC/pMLC

pMLC/TLC

potency
Continuous Read / Write (MB/s)

Up to 280/140

Up to 280/220

Operating temperature Grade2, Grade3, Industrial

±40~105℃/±40~85℃

±40~105℃/±40~85℃

Core Voltage, (VCC)

3.3V

3.3V

I / O voltage (VCCQ)

1.8V or 3.3V

1.8V or 3.3V

reliability
W/E Endurance

pSLC:30K/TLC/pMLC:≥ 3K

TLC/pMLC:≥ 3K

Data preservation period

1year @ Life end
10years @ initial

1year @ Life end
10years @ initial



PS8231 Series specifications and functional features

capacity

16GB

32GB

64GB

128GB

joggle

eMMC 5.1 HS400

eMMC 5.1 HS400

eMMC 5.1 HS400

eMMC 5.1 HS400

package

153 Ball
(11.5x13x1.0mm)

153 Ball
(11.5x13x1.0mm)

153 Ball
(11.5x13x1.0mm)

153 Ball
(11.5x13x1.0mm)

Flash Memory

64 Layers

64 Layers

64 Layers

64 Layers

Flash type

pSLC/TLC

pSLC/TLC

TLC

TLC

potency
Continuous Read / Write (MB/s)

Up to 320/250

Up to 320/250

Up to 320/250

Up to 320/250

Operating temperature is Grade2 / Grade3 / Industrial

±40~105℃/±40~85℃

±40~105℃/±40~85℃

±40~105℃/±40~85℃

±40~105℃/±40~85℃

Core Voltage, (VCC)

3.3V

3.3V

3.3V

3.3V

I / O voltage (VCCQ)

1.8V or 3.3V

1.8V or 3.3V

1.8V or 3.3V

1.8V or 3.3V

reliability
W/E Endurance

pSLC:40K/TLC:≥ 3K

pSLC:40K/TLC:≥ 3K

TLC:≥ 3K

TLC:≥ 3K

Data preservation period

2year @ Life end
10years @ initial

2year @ Life end
10years @ initial

2year @ Life end
10years @ initial

2year @ Life end
10years @ initial



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