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May 18, 2022Provide PHISON Finished Products
Small, flexible design for a variety of applications
PHISON's μSSD (BGA SSD) design is based on JEDEC standards and the latest SATA & PCIe interfaces to simplify customer PCB design and improve board-level reliability.
SATA up to 512GB capacity and PCIe up to 1TB capacity, not only support a full range of temperature, but also meet the IATF 16949 standard and can freely choose JEDEC/JESD-22 specifications.
PHISON's μSSD (BGA SSD) is equipped with smart firmware functions and provides customized firmware services to achieve reliable and differentiated solutions.
model | S11T | E13TI | E21TI |
joggle | SATA III | PCIe Gen 3 x 2 | PCIe Gen 4 x 4 |
manufacture procedure | 40nm | 28nm | 12nm |
ECC machine-processed | LDPC | LDPC | LDPC |
Security encryption protection | N/A | TCG OPAL | TCG OPAL |
Flash memory support | 3D TLC | 3D TLC | 3D TLC |
package | 156-Balls | 345-Balls - Type 1113 | 291-Balls Type 1620 / 345-Balls Type 1113 |
capacity | 8GB~512GB | 128GB~512G | 256GB~1TB |
potency | Up to 550/480 MB/s | Up to 1700/1400 MB/s | Up to 3600/3000 MB/s (Est.) |
Hot transmission induction | No | Yes | Yes |
power dissipation | 1.5W | 1.8W | 3.5W (Est.) |
P/E Cycle | 3,000 | 3,000 | 3,000 |
SRAM protect | 1-bit Detection | 2-bit Detection | 2-bit Detection |
Intelligent temperature control and FM system | N/A | Support | Support |
Operating temperature | 0 ~ 70°C -40 ~ 85°C | 0 ~ 70°C -40 ~ 85°C | 0 ~ 70°C -40 ~ 85°C |
Indasina, a group corporation composed of factories, is committed to a variety of electronic products and the overall customized solutions.
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