Nanya NT5CB128M16JR-FL TFBGA-96 DDR SDRAM
The 2Gb Double-Data-Rate-3 (DDR3(L)) is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAMs.
The 4Gb Double-Data-Rate-3 (DDR3(L)) DRAM is a high-speed CMOS SDRAM containing 4,294,967,296 bits. It is internally configured as an octal-bank DRAM.
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NANYADescriptions
The 4Gb Double-Data-Rate-3 (DDR3(L)) DRAM is a high-speed CMOS SDRAM containing 4,294,967,296 bits. It is internally configured as an octal-bank DRAM.
The 4Gb chip is organized as 64Mbit x 8 I/O x 8 banks and 32Mbit x16 I/O x 8 banks. These synchronous devices achieve high speed double-data-rate transfer rates of up to 2133 Mb/sec/pin for general applications.
The chip is designed to comply with all key DDR3(L) DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and falling). All I/Os are synchronized with a single ended DQS or differential DQS pair in a source synchronous fashion.
These devices operate with a single 1.5V ± 0.075V or 1.35V -0.067V/+0.1V power supply and are available in BGA packages.
Features
Basis DDR3 Compliant
- 8n Prefetch Architecture
- Differential Clock(CK/) and Data Strobe(DQS/) - Double-data rate on DQs, DQS and DM
Data Integrity
- Auto Self Refresh (ASR) by DRAM built-in TS - Auto Refresh and Self Refresh Modes Power Saving Mode
- Power Down Mode
Signal Integrity
- Configurable DS for system compatibility
- Configurable On-Die Termination
- ZQ Calibration for DS/ODT impedance accuracy via
external ZQ pad (240 ohm ± 1%)
Signal Synchronization
- Write Leveling via MR settings 5 - Read Leveling via MPR
Interface and Power Supply
- SSTL_15 for DDR3:VDD/VDDQ=1.5V(±0.075V) - SSTL_1352
for DDR3L:VDD/VDDQ=1.35V(-0.067/+0.1V)
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